Diamond GaN devices and associated methods

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United States of America Patent

PATENT NO 8183086
APP PUB NO 20100314627A1
SERIAL NO

12774089

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Abstract

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Semiconductor devices and methods of making thereof are provided. In one aspect, for example, a method for making a semiconductor device can include polishing a working surface of a diamond layer to a substantially flat surface, depositing a buffer layer on the working surface of the diamond layer, and depositing a semiconductor layer on the buffer layer. In one specific aspect, the c-axis of the buffer layer is oriented perpendicular to the working surface of the diamond layer.

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Patent Owner(s)

Patent OwnerAddress
RITEDIA CORPORATIONNO 17 KUANG-FU N RD HSIN CHU INDUSTRIAL PARK 30351

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Sung, Chien-Min Tansui, TW 268 5322

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