Antennas using chip-package interconnections for millimeter-wave wireless communication
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United States of America Patent
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May 15, 2012
Grant Date -
Nov 11, 2010
app pub date -
May 8, 2009
filing date -
May 8, 2009
priority date (Note) -
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Abstract
A compact millimeter-wave transmitter and receiver make use of interconnections within a chip-containing package for providing an integrated antenna. Due to shorter wavelength of millimeter-waves, these interconnections can be used as antennas for radiation of electromagnetic waves. A dielectric cover or lens is provided within the package to increase the antenna's directivity and to provide a mechanical shield for the chip.
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