Semiconductor device having GaN-based semiconductor layer and select composition ratio insulating film

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United States of America Patent

PATENT NO 8178900
APP PUB NO 20060220063A1
SERIAL NO

11392785

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Abstract

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A semiconductor device includes a GaN-based semiconductor layer formed on a substrate, and an insulating film composed of any one of silicon nitride in which the composition ratio of silicon to nitrogen is 0.85 to 3.0, silicon oxide in which the composition ratio of silicon to oxygen is 0.6 to 3.0, or silicon oxide nitride in which the composition ratio of silicon to nitrogen and oxygen is 0.6 to 3.0 that is formed on a surface of the GaN-based semiconductor layer, a gate electrode formed on the GaN-based semiconductor layer, and a source electrode and a drain electrode formed with the gate electrode therebetween.

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Patent Owner(s)

Patent OwnerAddress
EUDYNA DEVICES INCYAMANASHI PREFECTURE YAMANASHI

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Komatani, Tsutomu Nakakoma-gun, JP 23 206
Kurachi, Shunsuke Nakakoma-gun, JP 8 117

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