Biaxially oriented film laminated board, electrical insulation board and machine part
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United States of America Patent
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May 15, 2012
Grant Date -
Oct 15, 2009
app pub date -
Nov 21, 2006
filing date -
Nov 28, 2005
priority date (Note) -
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Abstract
Disclosed is a biaxially oriented film laminated board having a thickness of 0.5 mm or more, wherein biaxially oriented films composed of a resin composition having a melting point of 240° C. or higher are laminated at a multi-layer condition without interposing an adhesive therebetween. This biaxially oriented film laminated board is characterized in that the minimum value among the elongation at break in the longitudinal direction and that in the transverse direction is 25% or more when the board is punched into a rectangular form. Also disclosed are various electrical insulation boards and machine parts each using the laminated board. A laminated board having properties of a biaxially oriented film including thermal resistance, electrical insulation, mechanical strength, flexibility and workability can be obtained.
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