Semiconductor chip pad structure and method for manufacturing the same
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United States of America Patent
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May 1, 2012
Grant Date -
Oct 21, 2010
app pub date -
Mar 30, 2010
filing date -
Apr 17, 2009
priority date (Note) -
Expired
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Abstract
A semiconductor chip pad structure and a method for manufacturing the same, wherein a flat area at the center of the terminal pad and a roughened area at the periphery thereof are provided by use of the mask photolithograph technique and the roughening process. The central area provides a sufficient adhering force for the ball bond while the peripheral area prevents the wire-bonding vibrating energy from the lateral transmission to the external side of the terminal pad. In this way, the ball bond for the terminal pad may meet the wire-bonding requirements. Moreover, the ball bond quality is ensured.
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