Nested integrated circuit package on package system
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United States of America Patent
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May 1, 2012
Grant Date -
Dec 20, 2007
app pub date -
Aug 31, 2007
filing date -
Feb 4, 2005
priority date (Note) -
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Abstract
A package on package system is provided including providing a first substrate having a first integrated circuit thereon and a second substrate having a second integrated circuit thereon, the second substrate having a recess provided therein. The first and second substrates are mounted having the first integrated circuit at least partially nested in the recess.
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