Flow sensor and manufacturing method therefor
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United States of America Patent
Stats
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May 1, 2012
Grant Date -
Mar 26, 2009
app pub date -
Aug 14, 2008
filing date -
Sep 20, 2007
priority date (Note) -
In Force
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Abstract
A flow sensor may be formed by bonding a sensor chip formed with a flow rate detecting part and a flow path-forming member that is provided on the sensor chip and is formed with a flow path for a fluid flowing in the flow rate detecting part to each other on the upper surface of a substrate. The flow path-forming member may be formed by bonding a transparent first flow path forming member and a second flow path-forming member to each other. The first flow path forming member has a plate shape, and is provided with an inflow port and a outflow port for the fluid to be measured, and the second flow path forming member has a plate shape, and is provided with a through hole that forms the flow path along the flow of the fluid flowing along the flow rate detecting part.

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- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
Patent Owner | Address | |
---|---|---|
YAMATAKE CORPORATION | CHIYODA-KU TOKYO 100-6419 |
International Classification(s)

- [Classification Symbol]
- [Patents Count]
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
Hatakeyama, Hiroshi | Tokyo, JP | 19 | 166 |
Ike, Shinichi | Tokyo, JP | 28 | 101 |
Tsuchiya, Satoshi | Tokyo, JP | 135 | 967 |
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Fee | Large entity fee | small entity fee | micro entity fee |
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Surcharge after expiration - Late payment is unavoidable | $700.00 | $350.00 | $175.00 |
Surcharge after expiration - Late payment is unintentional | $1,640.00 | $820.00 | $410.00 |
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