Refrigeration capacity banking for thermal cycling
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United States of America Patent
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May 1, 2012
Grant Date -
Apr 8, 2010
app pub date -
Oct 8, 2008
filing date -
Oct 8, 2008
priority date (Note) -
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Abstract
A thermal cycling system includes a structure defining a load space, a heating assembly positioned to heat to the load space, and a cooling assembly positioned to cool the load space. The cooling assembly includes a refrigeration circuit and a banking circuit. The refrigeration circuit has a compressor, a refrigeration condenser, a first refrigeration evaporator in direct thermal communication with the load space, a second refrigeration evaporator in parallel with the first evaporator, and primary refrigerant circulating throughout the refrigeration circuit. The banking circuit is gravity fed and includes a banking condenser, a banking evaporator positioned to cool the load space, and a banking refrigerant circulating throughout the banking circuit. The banking condenser includes a collection reservoir to store liquid banking refrigerant and is in thermal communication with the second refrigeration evaporator.
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