Leveling method for burying evaporating section of heat pipe into thermally conductive seat
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United States of America Patent
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Apr 24, 2012
Grant Date -
Apr 8, 2010
app pub date -
Jun 3, 2009
filing date -
Oct 3, 2008
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Abstract
A leveling method for burying an evaporating section of a heat pipe into a thermally conductive seat is provided for an assembly of heat pipe and heat-conducting seat by simultaneously making the evaporating section of heat pipe partially formed into a flat surface when the evaporating section of heat pipe is being burying into the thermally conductive seat. Furthermore, in cooperation with a stamping machine, the leveling method is to make a multiple steps of press-fitting process to an evaporating section of heat pipe under a condition that there is no need to change the stamping die.
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