Semiconductor device, lead-frame product used for the same and method for manufacturing the same
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United States of America Patent
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Apr 17, 2012
Grant Date -
Mar 20, 2008
app pub date -
Sep 11, 2007
filing date -
Sep 12, 2006
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A semiconductor device includes a semiconductor element; a group of back-inner terminals coupled with the semiconductor element through bonding wires and arranged in an area array shape so as to be exposed inside of the bottom; a group of back-outer terminals arranged outside the group of back-inner terminals; a group of front-outer terminals located immediately above the back-outer terminals to be exposed from the front surface, which are electrically coupled with the back-outer terminals located immediately therebelow through coupling conductors, respectively; and a sealing resin which seals the semiconductor element and bonding wires and non-exposed portions of said back-inner terminals, back-outer terminals and front-outer terminals. On at least the respective terminal faces of said back-inner terminals, back-outer terminals and front-outer terminals, noble-metal plated layers are formed.
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