Recycling printed circuit boards
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Apr 17, 2012
Grant Date -
Oct 16, 2008
app pub date -
Nov 24, 2005
filing date -
Nov 25, 2004
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A method of recycling radio frequency printed circuit boards comprising track material printed on a laminate having a known dielectric constant using the steps of separating the substrate of one or more circuit boards from the track material; and processing the separated material to form a thin layer of substrate material suitable for relaminating with track material to provide a product for use in the manufacture of a further radio frequency printed circuit board. The method may separate the material from the laminate by grinding or use of an etchant.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully