Light emitting diode substrate assembly
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United States of America Patent
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Apr 17, 2012
Grant Date -
Jun 2, 2011
app pub date -
Dec 1, 2009
filing date -
Dec 1, 2009
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A light emitting diode substrate assembly has a metal substrate, a circuit board, multiple chip strings, an annular wall and an encapsulant. The circuit board is mounted on the top surface of the substrate and has multiple through holes and multiple current conducting lines. The chip strings are mounted on the substrate and respectively in the through hole in the circuit board. Each chip string has at least one light emitting diode chip connected electrically to two corresponding current conducting lines on the circuit board with bonding wires. Accordingly, the heat generating during the operation of the chips can be efficiently dissipated from the substrate.
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