Apparatus and method for inspecting micro-structured devices on a semiconductor substrate
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United States of America Patent
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Apr 10, 2012
Grant Date -
Oct 25, 2007
app pub date -
May 23, 2005
filing date -
Jun 16, 2004
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Abstract
Previously used examination devices and methods mostly operate with reflected visible or UV light to analyze microstructured samples of a wafer (38), for example. The aim of the invention is to increase the possible uses of said devices, i.e. particularly in order to represent structural details, e.g. of wafers that are structured on both sides, which are not visible in VIS or UV because coatings or intermediate materials are not transparent. Said aim is achieved by using IR light as reflected light while creating transillumination (52) which significantly improves contrast in the IR image, among other things, thus allowing the sample to be simultaneously represented in reflected or transmitted IR light and in reflected visible light.
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