Layered chip package with heat sink
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United States of America Patent
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Apr 10, 2012
Grant Date -
May 6, 2010
app pub date -
Nov 3, 2008
filing date -
Nov 3, 2008
priority date (Note) -
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status (Latency Note)
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Abstract
A layered chip package includes: a plurality of layer portions stacked, each of the layer portions including a semiconductor chip; and a heat sink. Each of the plurality of layer portions has a top surface, a bottom surface, and four side surfaces. The heat sink has at least one first portion, and a second portion coupled to the at least one first portion. The at least one first portion is adjacent to the top surface or the bottom surface of at least one of the layer portions. The second portion is adjacent to one of the side surfaces of each of at least two of the plurality of layer portions.
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