Laminated substrates for mounting electronic parts and methods for making same
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United States of America Patent
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Apr 10, 2012
Grant Date -
Sep 11, 2008
app pub date -
Mar 13, 2008
filing date -
Sep 14, 2005
priority date (Note) -
Expired
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Abstract
A method is provided for producing a laminated substrate for mounting semiconductor chips. At least respective metal and plastic structure films having respective different recurrent contours are laminated together in such a way that a material strip is obtained. The lamination is followed by perforations or cuttings, and the method includes at least one of the following steps:
- A. the films are structured in such a way that superposition thereof makes it possible to obtain the areas which are devoid of overlap through the total width thereof;B. the films are not laminated through the total width of the laminate in partly recurrent areas; andC. recurrent segments of the recurrent contours are bent out of the surface of the laminated strip starting from the laminate.
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