AG-based alloy sputtering target

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United States of America Patent

PATENT NO 8152976
APP PUB NO 20090057141A1
SERIAL NO

12198520

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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The invention relates to an Ag-based alloy sputtering target including at least one element selected from the group consisting of Ti, V, W, Nb, Zr, Ta, Cr, Mo, Mn, Fe, Co, Ni, Cu, Al, and Si in a total amount of 1 to 15% by weight, in which the Ag-based alloy sputtering target has an arithmetic mean roughness (Ra) of 2 μm or more and a maximum height (Rz) of 20 μm or more at a sputtering surface thereof.

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Patent Owner(s)

Patent OwnerAddress
SONY DADC CORPORATION1-12 KITASHINAGAWA 5-CHOME SHINAGAWA-KU TOKYO

International Classification(s)

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  • 2008 Application Filing Year
  • C23C Class
  • 1299 Applications Filed
  • 709 Patents Issued To-Date
  • 54.59 % Issued To-Date
Click to zoom InYear of Issuance% of Matters IssuedCumulative IssuancesYearly Issuances2008200920102011201220132014201520162017201820192020202120220255075100

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Matsuzaki, Hitoshi Hyogo, JP 17 178
Okawa, Naoki Tokyo, JP 11 31
Tauchi, Yuki Hyogo, JP 31 190

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Patent Citation Ranking

  • 1 Citation Count
  • C23C Class
  • 4.98 % this patent is cited more than
  • 13 Age
Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges404301516651271110362701 - 1011 - 2021 - 3031 - 4041 - 5051 - 6061 - 7071 - 8081 - 9091 - 100100 +0255075100125150175200225250275300325350375400425450475

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