Method for determining the systematic error in the measurement of positions of edges of structures on a substrate resulting from the substrate topology

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United States of America Patent

PATENT NO 8149383
APP PUB NO 20090033894A1
SERIAL NO

12219000

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Abstract

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A method for determining the lateral correction as a function of the substrate topology and/or the geometry of the substrate holder is disclosed. The substrate is placed on a measuring stage traversable in the X coordinate direction and Y coordinate direction, which carries the substrate to be measured. The substrate is supported on at least three support points which define a plane. An apparatus is provided for determining the position of a plurality of positions on the surface of the substrate in the in the X, Y and Z coordinate directions. The substrate is tiltable about an axis parallel to the X/Y plane, to enable the substrate to be measured in a tilted position.

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Patent Owner(s)

Patent OwnerAddress
VISTEC SEMICONDUCTOR SYSTEMS GMBH35781 WEILBURG

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Czerkas, Slawomir Weilburg, DE 8 26

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