Process for producing a contact area of an electronic component
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United States of America Patent
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Apr 3, 2012
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N/A
app pub date -
Sep 13, 2010
filing date -
Sep 17, 2009
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Abstract
A process for forming at least one local contact area of a substrate of an electrical component for contacting the contact area with a connector, in which the substrate, on the contact side, is provided with a sintered porous metal layer. To make available a mechanically durable, electrically faultless solderable contact area, it is proposed that the porous layer be compacted and/or removed in the contact area to be formed.
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