Gold alloy wire for ball bonding

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United States of America Patent

PATENT NO 8147750
SERIAL NO

12224212

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Abstract

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There is provided a gold alloy wire for a ball bonding. The gold alloy consists of 10 to 50 ppm by mass of magnesium (Mg); 5 to 20 ppm by mass of europium (Eu); 2 to 9 ppm by mass of calcium (Ca); and a remaining portion being gold (Au) having a purity of a minimum of 99.998% by mass. In the gold alloy wire for a ball bonding, an addition amount of calcium (Ca) is a maximum of half that of europium (Eu).

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Patent Owner(s)

Patent OwnerAddress
TANAKA DENSHI KOGYO K K2303-15 YOSHIDA YOSHINOGARI-CHO KANZAKI-GUN SAGA 842-0031

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kuwahara, Takeshi Saga, JP 69 233
Takada, Mitsuo Saga, JP 5 9
Teshima, Satoshi Saga, JP 17 133

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