Method of manufacturing a device incorporated substrate and method of manufacturing a printed circuit board
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United States of America Patent
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Apr 3, 2012
Grant Date -
Sep 3, 2009
app pub date -
May 4, 2009
filing date -
Jul 31, 2002
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A method of manufacturing a device-incorporated substrate as well as a printed circuit board. A transfer sheet is formed having a structure that includes two layers, a metal base material and a dissolvee metal layer and a conductor pattern is formed on the dissolvee metal layer by electroplating. After the transfer sheet on which the conductor pattern is formed is adhered onto an insulating base material, the transfer sheet is removed by separating the metal base material from the dissolvee metal layer and thereafter selectively dissolving and removing the dissolvee metal layer with respect to the conductor pattern.
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