Method for forming resist pattern, method for producing circuit board, and circuit board
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United States of America Patent
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Mar 27, 2012
Grant Date -
Sep 24, 2009
app pub date -
May 17, 2006
filing date -
May 17, 2006
priority date (Note) -
Expired
status (Latency Note)
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Abstract
There are provided a method for forming a resist pattern for preparing a circuit board having a landless or small-land-width through-hole(s) to realize a high-density circuit board, a method for producing a circuit board, and a circuit board. A method for forming a resist pattern, comprising the steps of forming a resin layer and a mask layer on a first surface of a substrate having a through-hole(s), and removing the resin layer on the through-hole(s) and on a periphery of the through-hole(s) on the first surface by supplying a resin layer removing solution from a second surface opposite to the first surface of the substrate, and a method for producing a circuit board using the method for forming a resist pattern, and a circuit board.
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