Liquid crystal polymer layer for encapsulation and improved hermiticity of circuitized substrates
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United States of America Patent
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Mar 27, 2012
Grant Date -
Mar 22, 2012
app pub date -
Sep 17, 2010
filing date -
Sep 17, 2010
priority date (Note) -
Expired
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Abstract
A substrate and method for making same for use in electronic packages having a core layer of copper-invar-copper (CIC) with a layer of polytetrafluoroethylene (PTFE) placed upon both sides of the CIC. A layer of etched copper foil is placed on the outer surface of each PTFE layer. A layer of liquid crystal polymer (LCP) is placed on both layers of etched copper foil. An external layer of etched copper foil is placed on the external surface of the LCP layers.
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