Adhesive composition
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United States of America Patent
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Mar 27, 2012
Grant Date -
Oct 2, 2008
app pub date -
Jun 9, 2008
filing date -
Mar 28, 2003
priority date (Note) -
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status (Latency Note)
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Abstract
An adhesive composition for use in the manufacture of wood-based boards, wherein the adhesive composition is foamable and comprises a resin, a filler and a foaming agent without any cationic acrylamide copolymer. According to the invention, the adhesive composition contains 40-80 wt % resin, 5-30 wt % filler, 0-40 wt % solvent, and 0.1-10 wt % foaming agent, which has been selected from organic and/or inorganic surface-active sulfate, sulfonate, phosphate or phosphonate compounds or their derivatives or mixtures.
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International Classification(s)
- C08J:WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTE....
- C03C:CHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREO....
- C08G:MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN B....
- C04B:LIME; MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREO....
- C08F:MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONL....
- C08L:COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08K:USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUB....
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