Wire bonding method and semiconductor device
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United States of America Patent
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Mar 27, 2012
Grant Date -
Aug 19, 2010
app pub date -
Oct 21, 2009
filing date -
Oct 27, 2008
priority date (Note) -
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status (Latency Note)
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Abstract
After forming a pressure-bonded ball and a ball neck by bonding an initial ball to a pad, a capillary is moved upward, away from a lead, and then downward, thereby the ball neck is trodden on by a face portion that is on the lead side of the capillary. Subsequently, the capillary is moved upward and then toward the lead until the face portion of the capillary is positioned above the ball neck, thereby a wire is folded back toward the lead. Then, the capillary is moved downward such that a side of the wire is pressed by the capillary against the ball neck that has been trodden on. After the capillary is moved obliquely upward toward the lead and then looped toward the lead, the wire is pressure-bonded to the lead.
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