Method of fabricating a semiconductor multi-package module having wire bond interconnect between stacked packages
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United States of America Patent
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Mar 27, 2012
Grant Date -
Dec 20, 2007
app pub date -
Aug 31, 2007
filing date -
Sep 17, 2002
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Abstract
A method for making a semiconductor multi-package module includes; providing a lower molded package including a lower substrate and a die, affixing an upper molded package including an upper substrate onto the upper surface of the lower package, and forming z-interconnects between the upper and lower substrates.
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