Method of forming a circuit board with improved via design
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United States of America Patent
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Mar 27, 2012
Grant Date -
Apr 23, 2009
app pub date -
Dec 29, 2008
filing date -
Jun 27, 2002
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A circuit board or each circuit board of a multi-layer circuit board includes an electrically conductive sheet coated with an insulating top layer covering one surface of the conductive sheet, an insulating bottom layer covering another surface of the conductive sheet and an insulating edge layer covering an edge of the conductive sheet. An insulating interlayer can be sandwiched between a pair of adjacent circuit boards of a multi-layer circuit board assembly. A landless through-hole or via can extend through one or more of the circuit boards for connecting electrical conductors on opposing surfaces thereof.
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