Silicone containing encapsulant
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United States of America Patent
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Mar 20, 2012
Grant Date -
Mar 3, 2011
app pub date -
Dec 3, 2009
filing date -
Aug 25, 2009
priority date (Note) -
Expired
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Abstract
The present invention relates to a silicone containing encapsulant composition. One embodiment of the encapsulant composition comprises (a) 30˜60 weight % of an epoxy resin; (b) 30˜60 weight % of an acid anhydride curing agent; (c) 0.1˜30 weight % of a Carbinol function silicone resin which can form a homogeneous mixture with (a) and (b) described above; and (d) 0.1˜5 weight % of a reactive UV absorber or HALS; and reactive anti-oxidant and/or phosphor containing flame retardant. The encapsulant composition can be used for a solid state light emitting device to achieve low internal stress and better -anti-yellowing performance.
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