Packaged heat dissipating assembly for an intermediate bus converter
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United States of America Patent
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Mar 13, 2012
Grant Date -
Aug 26, 2010
app pub date -
Jul 29, 2009
filing date -
Feb 24, 2009
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A packaged heat dissipating assembly for an intermediate bus converter (IBC) has a frame being mounted on and around the IBC and a heat sink being mounted on the frame. The packaged heat dissipating assembly is easily detached from the IBC. Therefore, a broken bus converter module (BCM) or heat sink is easily replaced separately. Consequently, heat dissipating designs and maintenance of a server or communication equipment is facilitated and maintenance costs of the IBC and the server or communication equipment are lowered.
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