Method for manufacturing electronic device and electronic device
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United States of America Patent
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Mar 13, 2012
Grant Date -
Jan 18, 2007
app pub date -
Dec 24, 2003
filing date -
Dec 27, 2002
priority date (Note) -
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Abstract
A method for manufacturing an electronic device comprises a step for forming a coating film (100) on a surface of a conductor portion-containing body (500), a step for forming a photosensitive film (110) on the conductor (500) on which the coating film (100) has been formed, a step for exposing the photosensitive film (110) to a pattern corresponding to a patterned recessed or protruded portion, a step for developing the exposed photosensitive film (110), and a step for baking the developed photosensitive film (110). With this method, an excessive removal of a metal film can be prevented or suppressed.
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