Equipment and method for cutting package

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 8132305
APP PUB NO 20080056832A1
SERIAL NO

11848152

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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A package cutting apparatus includes at least two spindles installed at a sawing robot and cutting a frame including a plurality of packages into packages using cutting bits; a frame loading jig loading the frame so that the frame is cut; and a frame-and-unit picker installed at an orthogonal robot to load and unload the frame on and from the frame loading jig, wherein a state of the cutting bit installed at the spindle is checked.

First Claim

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Patent Owner(s)

Patent OwnerAddress
SAMSUNG ELECTRONICS CO LTD129 SAMSUNG-RO YEONGTONG-GU SUWON-SI GYEONGGI-DO 16677

International Classification(s)

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  • 2007 Application Filing Year
  • B23P Class
  • 1310 Applications Filed
  • 402 Patents Issued To-Date
  • 30.69 % Issued To-Date
Click to zoom InYear of Issuance% of Matters IssuedCumulative IssuancesYearly Issuances2007200820092010201120122013201420152016201720180255075100

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Choi, Tai-Kew Chungcheongnam-do, KR 2 8
Eum, Yo-Se Chungcheongnam-do, KR 5 6
Jang, Ho-Soo Busan, KR 4 5
Sun, Yong-Kyun Chungcheongnam-do, KR 7 40
Yang, Hee-Sang Chungcheongnam-do, KR 7 22

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Patent Citation Ranking

  • 3 Citation Count
  • B23P Class
  • 12.40 % this patent is cited more than
  • 13 Age
Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges6135360113111101 - 1011 - 2021 - 3031 - 4041 - 5061 - 7091 - 100100 +0100200300255075125150175225250275325350375

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