Microsystem component with a device deformable under the effect of temperature changes
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United States of America Patent
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Mar 6, 2012
Grant Date -
Aug 27, 2009
app pub date -
Jan 4, 2006
filing date -
Jan 5, 2005
priority date (Note) -
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Abstract
A microsystem component with a device (3) deformable under the influence of temperature changes is disclosed. The device comprises at least one first (4, 5) and second (8) element with differing thermal expansion coefficients and different thermal conductivities. The elements (4, 5; 8) are physically separate and arranged and connected to each other such that the device (3) assumes flexure states which are dependent on the temperature.
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