Photosensitive molecular compound and photoresist composition including the same

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United States of America Patent

PATENT NO 8124311
APP PUB NO 20090197198A1
SERIAL NO

12361833

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Abstract

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Disclosed are a photosensitive compound containing oxime group which is directly decomposed by exposure to light, which is a molecular resist whose size is smaller than conventional polymer for photoresist, and a photoresist composition including the same. The photosensitive molecular compound has a structure represented by a following formula.

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Patent Owner(s)

Patent OwnerAddress
DONGJIN SEMICHEM CO LTDINCHON SOUTH KOREA INCHEON

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Jang, Eu-Jean Hwaseong-Si, KR 5 21
Kim, Jae-Hyun Seoul, KR 351 2242
Kim, Jeong-Sik Hwaseon-Si, KR 15 62
Lee, Jae-Woo Bucheon-Si, KR 47 304
Lee, Jung-Youl Anyang-Si, KR 13 92

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