Wafer manufacturing method and device
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United States of America Patent
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Feb 28, 2012
Grant Date -
May 8, 2008
app pub date -
Nov 5, 2007
filing date -
Nov 8, 2006
priority date (Note) -
Expired
status (Latency Note)
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Abstract
The invention relates to a device for manufacturing semiconductor material wafers with a sawing device for the sawing of slices attached to a saw holder, a pre-cleaning device arranged in the process direction downstream of the sawing device for pre-cleaning the surfaces of the slices hanging on the saw holder, and a degluing device arranged downstream in the process direction for detaching the slices from the saw holder.
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