Airflow guiding and heat dissipating assembly for electronic device
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United States of America Patent
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-
Feb 21, 2012
Grant Date -
Aug 26, 2010
app pub date -
Jun 16, 2009
filing date -
Feb 25, 2009
priority date (Note) -
Expired
status (Latency Note)
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Abstract
An airflow guiding and heat dissipating assembly is mounted in an electronic device and has a base and at least one baffle being mounted on the base. Multiple electronic components are mounted on the base and are arranged in a line. Airflow flows along one electronic component upstream, past the baffle and then over the other electronic component downstream to take away heat from the electronic component. The baffle prevents the airflow from becoming turbulent and, therefore, temperatures of the electronic component are lowered efficiently.
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