Self-supported film and silicon wafer obtained by sintering
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United States of America Patent
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Feb 7, 2012
Grant Date -
Nov 19, 2009
app pub date -
May 13, 2009
filing date -
May 16, 2008
priority date (Note) -
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Abstract
A silicon wafer for a photovoltaic cell is produced by a debinding step of a self-supported film formed of at least one main thin layer comprising at least 50% volume of silicon particles, devoid of silicon oxide and encapsulated in a polymer matrix protecting them against oxidation, followed by a sintering step to form the silicon wafer.
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