Semiconductor device and manufacturing method of the same
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United States of America Patent
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Jan 31, 2012
Grant Date -
Feb 21, 2008
app pub date -
Dec 22, 2006
filing date -
Aug 16, 2006
priority date (Note) -
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Abstract
A semiconductor device includes a semiconductor element provided over a wiring board; sealing resin configured to seal the semiconductor element; and reinforcing resin provided at least at a part of a boundary part of the sealing resin and the wiring board. In the above-mentioned semiconductor device, the reinforcing resin may be provided along a perimeter of the boundary part of the sealing resin and the wiring board. The reinforcing resin may be provided at a boundary part of the sealing resin and the wiring board in a vicinity of a corner part of the sealing resin.
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