Solder ball mounting method and apparatus
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United States of America Patent
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-
Jan 31, 2012
Issued Date -
N/A
app pub date -
May 8, 2008
filing date -
May 8, 2007
priority date (Note) -
Expired
status (Latency Note)
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Abstract
The periphery of a mask (3) is formed higher than a region where a ball holding hole (3a) is formed, a work (1) is arranged at a lower section of the ball holding hole (3a) of the mask (3), and the ball holding hole (3a) and an electrode of the work (1) are aligned with each other. A ball (B) is applied on the mask (3), and in such state, vibration is applied to the mask (3) to move the solder ball (B) on the surface of the mask (3) and drop the solder ball (B) into the ball holding hole (3a). The periphery of the mask (3) is permitted to be lower than the ball holding hole (3a), and an excessive portion of the solder ball (B) is recovered from over the mask (3).
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