Dicing film having shrinkage release film and method for manufacturing semiconductor package using the same
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United States of America Patent
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Jan 24, 2012
Grant Date -
Aug 5, 2010
app pub date -
Apr 12, 2010
filing date -
Mar 25, 2004
priority date (Note) -
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Abstract
The present invention relates to a dicing film having an adhesive film for dicing a wafer and a die adhesive film, which are used for manufacturing a semiconductor package, and a method of manufacturing a semiconductor package using the same. More particularly, the present invention relates to a dicing film wherein a shrinkage release film is inserted between an adhesive film for dicing a wafer and a die adhesive film so that the die adhesive film and a die can be easily separated from the adhesive film for dicing a wafer when picking up a semiconductor die, and a method of manufacturing a semiconductor package using the same.
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