Semiconductor device and method of manufacturing the same
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United States of America Patent
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Jan 17, 2012
Grant Date -
Jul 16, 2009
app pub date -
Dec 16, 2008
filing date -
Jan 11, 2008
priority date (Note) -
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Abstract
In the manufacture of semiconductor devices, cracking of a resin member caused during cutting and defects in the external appearance are prevented.
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