Interconnect structures and methods
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United States of America Patent
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Jan 17, 2012
Grant Date -
Apr 15, 2010
app pub date -
Oct 15, 2008
filing date -
Oct 15, 2008
priority date (Note) -
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Abstract
Interconnect structures and methods are disclosed. In one embodiment, an interconnect structure includes a via extendable through a workpiece from a first side of the workpiece to a second side of the workpiece. The via is partially filled with a conductive material and has sidewalls. The interconnect structure includes a contact coupled to the conductive material in the via proximate the first side of the workpiece. The conductive material in the via comprises a recessed region comprising a landing zone proximate the second side of the workpiece.
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