Method for surface treating semiconductor

United States of America Patent

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Jan 17, 2012
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May 7, 2009
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Aug 15, 2006
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Aug 15, 2005

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Abstract

is subjected to removal of a native oxide film and then hydrogen bonding. The resultant heat remains in jig and makes it difficult to maintain the wafers to temperature appropriate to removal of a native oxide film., in which a native oxide film has been removed.

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Patent Owner	Address
ULVAC INC	KANAGAWA JAPAN KANAGAWA
F T L CO LTD	KAWASAKI-SHI KANAGAWA

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H01L:SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICE....

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Inventor Name	Address	# of filed Patents	Total Citations
Inoue, Hiroaki	Shizuoka, JP	220	2885
Miura, Yutaka	Shizuoka, JP	33	501
Satou, Masayuki	Shizuoka, JP	43	224
Takagi, Mikio	Kanagawa, JP	46	1268
Takahashi, Seiichi	Shizuoka, JP	60	766

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Method for surface treating semiconductor

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United States of America Patent

11990440

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PATENT NO	8097541
APP PUB NO	20090117747A1
SERIAL NO	11990440
DOCKET NO

US Family Size	Non-US Coverage
Patent Longevity	Forward Citations

DATE PUBLISHED	PUBLICATION/PATENT NO.	PUBLICATION TYPE
January 17, 2012	US,8097541,B2 US8097541B2	GRANTED PATENT AS SECOND PUBLICATION
May 07, 2009	US,20090117747,A1 US20090117747A1	FIRST PUBLISHED PATENT APPLICATION

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