Method of placing a component by means of a placement device at a desired position on a substrate holder, and device suitable for performing such a method
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United States of America Patent
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Jan 10, 2012
Grant Date -
Oct 13, 2005
app pub date -
May 20, 2003
filing date -
May 22, 2002
priority date (Note) -
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status (Latency Note)
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Abstract
A method places a component at a desired position on a substrate by means of a placement device. The component is transported to an intermediate position above the desired position and a position difference between the intermediate position and the desired position is determined by means of a camera and a processor. Subsequently, the component is transported to the desired position on the substrate, making use of the position difference. The camera, which is arranged at the side of the component opposite the component's side facing the substrate, takes an image of at least the portion of the substrate that includes the desired position as well as the placement device.
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