Circuit board structure employing ferrite element
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United States of America Patent
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Jan 10, 2012
Grant Date -
Aug 12, 2010
app pub date -
Mar 30, 2009
filing date -
Feb 6, 2009
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A circuit board structure includes a dielectric layer, a first metal layer, a second metal layer and a first ferrite element. The first metal layer is disposed on an upper surface of the dielectric layer and has a first circuit area, a second circuit area and a first metallic neck connecting the first circuit and the second circuit areas. The second metal layer is disposed on a lower surface of the dielectric layer and has a third circuit area, a fourth circuit area and at least a second metallic neck connecting the third circuit and the fourth circuit areas. The orthogonal projections of the first and the second metallic necks on the upper surface are not overlapped. The first ferrite element is disposed on the upper surface and overlays at least one of the orthogonal projections of the first and the second metallic necks on the upper surface.
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