Equipment for bonding by molecular adhesion
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United States of America Patent
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Jan 10, 2012
Grant Date -
Dec 3, 2009
app pub date -
Jun 23, 2009
filing date -
Nov 28, 2005
priority date (Note) -
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status (Latency Note)
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Abstract
The invention relates to equipment for carrying out a process for bonding by molecular adhesion of two substrates to one another during which the surfaces of the substrates are placed in close contact and bonding occurs by propagation of a bonding front between the substrates. The invention includes, prior to bonding, a step of modifying the surface state of one or both of the surfaces of the substrates so as to regulate the propagation speed of the bonding front. The surface can be modified by locally or uniformly heating or roughening the surface(s) of the substrate(s).
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International Classification(s)
- B29C:SHAPING OR JOINING OF PLASTICS; SHAPING OF SUBSTAN....
- B31F:MECHANICAL WORKING OR DEFORMATION OF PAPER OR CARD....
- F27D:DETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS, ....
- G05G:CONTROL DEVICES OR SYSTEMS INSOFAR AS CHARACTERISE....
- B27G:ACCESSORY MACHINES OR APPARATUS; TOOLS
- B32B:LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA....
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