Wiring structure of a substrate
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jan 3, 2012
Grant Date -
Sep 17, 2009
app pub date -
Mar 17, 2008
filing date -
Mar 17, 2008
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A wiring structure of a substrate adapted to mount a plurality of integrated circuits has a signal wire for connecting the integrated circuits to each other, first and second power supply layers faced to each other, and return path wires arranged generally in parallel to the signal wire. One of the return path wires has opposite terminal ends connected to the first power supply layer (Vcc layer). The other return path wire has opposite terminal ends connected to the second power supply layer (GND layer).
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully