Method of remedying deterioration of insulating film
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United States of America Patent
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Jan 3, 2012
Grant Date -
Apr 16, 2009
app pub date -
Apr 18, 2007
filing date -
Apr 19, 2006
priority date (Note) -
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Abstract
The present invention provides a method of remedying deterioration of an insulating film which, during the remedial treatment of an insulating film deteriorated by plasma treatment, does not leave residual remedial agent on the wiring material such as the copper wiring layer, can be conducted using a dry process, and exhibits excellent applicability to mass production. The insulating film that has been deteriorated by plasma treatment is brought into contact with a remedial agent composed of a compound with a molecular structure having at least one of a nitro group and a carbonyl group, and at least one of a hydrocarbon group and a hydrogen group.
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