Fabrication of advanced thermoelectric materials by hierarchical nanovoid generation
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United States of America Patent
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Dec 27, 2011
Grant Date -
Jul 23, 2009
app pub date -
Dec 4, 2008
filing date -
Dec 4, 2007
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Abstract
A novel method to prepare an advanced thermoelectric material has hierarchical structures embedded with nanometer-sized voids which are key to enhancement of the thermoelectric performance. Solution-based thin film deposition technique enables preparation of stable film of thermoelectric material and void generator (voigen). A subsequent thermal process creates hierarchical nanovoid structure inside the thermoelectric material. Potential application areas of this advanced thermoelectric material with nanovoid structure are commercial applications (electronics cooling), medical and scientific applications (biological analysis device, medical imaging systems), telecommunications, and defense and military applications (night vision equipments).
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