Component crimping apparatus control method, component crimping apparatus, and measuring tool

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United States of America Patent

PATENT NO 8078310
APP PUB NO 20090288462A1
SERIAL NO

12440776

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Abstract

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A component crimping apparatus control method which enables a measuring tool to directly measure a temperature of a part pressed by a pressing head. The component crimping apparatus control method is applied to a component crimping apparatus which crimps a component onto a plate-shaped workpiece, and causes a measuring tool shaped identically as the workpiece to measure a temperature or a pressure of a pressed part in a pressing process of pressing a component onto the workpiece using a heated pressing head. The method includes acquiring information indicating whether or not the measuring tool is held in the component crimping apparatus, and, in the case where the information indicating that the measuring tool is held is acquired, positioning the measuring tool identically as the workpiece, and executing the pressing process on the component to be attached to the measuring tool after the positioning.

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Patent Owner(s)

Patent OwnerAddress
MATSUSHITA ELECTRIC INDUSTRIAL CO LTDOSAKA JAPAN OSAKA

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Igarashi, Chihiro Osaka, JP 4 418
Nishimoto, Tomotaka Osaka, JP 7 444
Okada, Yasuhiro Osaka, JP 64 1199
Watanabe, Nobuhisa Osaka, JP 66 1442
Yoshitake, Takanori Saga, JP 5 456

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