Process for the production of an electrically conductive structure
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United States of America Patent
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Dec 13, 2011
Grant Date -
Jan 1, 2009
app pub date -
Jun 27, 2008
filing date -
Jun 29, 2007
priority date (Note) -
Expired
status (Latency Note)
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Abstract
The invention concerns a process for the production of an electrically conductive structure on a carrier substrate comprising at least two conductor track portions spaced in a region of a width b over the entire width b at between 500 μm and 1 μm and a multi-layer film body. A conductive layer in the form of the conductor track portions is produced on the surface of the carrier substrate. A metallic coating forming the electrically conductive structure is deposited on the conductive layer by application of a flow of current in an electrolyte which contains a dissolved coating metal. In the production of the conductive layer the conductive layer is additionally produced in the form of conductor track extensions which are arranged on both sides of the conductor track portions and which are convexly curved away from the oppositely disposed conductor track portion.
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