Method and apparatus for 3D interconnect
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United States of America Patent
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Dec 13, 2011
Grant Date -
Nov 12, 2009
app pub date -
May 9, 2008
filing date -
May 9, 2008
priority date (Note) -
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Abstract
The present invention discloses methods for depositing a material, particularly a conductive material, in cavities of a substrate and forming bonding contacts or pads thereon. An intracavity structure may be utilized in conjunction with embodiments of the present invention to provide efficient filling of diverse cavities within the substrate. Also provided are embodiments for interconnection structures using filled cavities, along with electrically conductive or reactive structures which may include capacitors fabricated within a substrate.
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